Nonflammable solvent compositions for dissolving polymers and resulting solvent systems

ABSTRACT

A solvent composition and method for making same is disclosed having a composition between 26 to 90 weight percent propionate, butyrate, or combination thereof and between 10 to 74 weight percent fluorinated solvent blend, wherein the fluorinated solvent blend includes t-DCE. A polymer solvent system is also disclosed incorporating the solvent composition and dissolved polymers, such as SEBS polymers. The solvent composition and polymer solvent system is minimally combustible or preferably nonflammable.

BACKGROUND

The present invention relates generally to the field of solvents. Moreparticularly, the present invention relates to solvent compositions thatdissolve polymers such as Styrene-Ethylene/Butylene-Styrene (SEBS) andcreate a liquid polymer solvent system having various uses such as incoatings, sealants, and/or adhesives. Furthermore, the solventcompositions and systems of the present invention are preferably classedas nonflammable or combustible, having a range of evaporation/dryingrates, and are preferably safe and relatively environmentally friendly.

The use of polymers such as SEBS polymers is extensive. For example,SEBS polymers are frequently used in adhesives, sealants, and coatings.SEBS polymers also have widespread industry usage through incorporationinto various products such as road surface materials, roofing materials,shoes, and packaging materials.

Liquid formulations of SEBS polymers have been used that incorporatehigh solvency solvents, such as toluene, to dissolve the SEBS polymer toa liquid solvent system that incorporates both the solvent and the SEBSpolymer. Known solvent compositions for dissolving SEBS, however, arehighly flammable and have significant health and environmental concerns.Thus, the resulting liquid SEBS solvent system is also flammable and hassignificant health and environmental concerns. Combustible andnonflammable materials are preferred for reasons such as having lessshipping/handling requirements compared with Flammable materials.

Thus, there is a need for a solvent composition that dissolves polymers,such as SEBS polymers, and is nonflammable or has low flammability whilealso maintaining non-hazardous health and environmental properties andcreates a liquid polymer solvent system that is preferably suitable foruse in cleaning agents, coatings, sealants, and/or adhesives.

SUMMARY

The present invention includes a solvent composition. In one embodimentof the invention, the solvent composition includes between 26 to 90weight percent of a propionate, and between 10 to 74 weight percent of afluorinated solvent blend, wherein the fluorinated solvent blendincludes t-DCE. In another embodiment of the invention, the solventcomposition includes between 26 to 90 weight percent of a butyrate, andbetween 10 to 74 weight percent of a fluorinated solvent blend, whereinthe fluorinated solvent blend includes t-DCE.

The present invention also includes a styrene solvent system. In oneembodiment of the invention, the styrene solvent system includes asolvent composition having between 26 to 90 weight percent of apropionate and between 10 to 74 weight percent of a fluorinated solventblend, wherein the fluorinated solvent blend includes t-DCE. The styrenesolvent system further includes a styrene block copolymer. In anotherembodiment of the invention, the styrene solvent system includes asolvent composition having between 26 to 90 weight percent of a butyrateand between 10 to 74 weight percent of a fluorinated solvent blend,wherein the fluorinated solvent blend includes t-DCE. The styrenesolvent system also further includes a styrene block copolymer.

The present invention also includes a styrene solvent system including afluorinated solvent comprising 90 weight percent t-DCE and 10 weightpercent HFE 7100. The styrene solvent system also includes a styreneblock copolymer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of boiling point versus percentconcentration of isoamyl propionate and Novec 72DE.

FIG. 2 is a schematic diagram of boiling point versus percentconcentration of isoamyl butyrate and Novec 72DE.

FIG. 3 is a schematic diagram of boiling point versus percentconcentration of amyl butyrate and Novec 72DE.

FIG. 4 is a schematic diagram of boiling point versus percentconcentration of hexyl propionate and Novec 72DE.

FIG. 5 is a schematic diagram of boiling point versus percentconcentration of n-butyl n-butyrate and Novec 72DE.

FIG. 6 is a schematic diagram of boiling point versus percentconcentration of isoamyl isobutyrate and Novec 72DE.

FIG. 7 is a schematic diagram of boiling point versus percentconcentration of amyl isobutyrate and Novec 72DE.

FIG. 8 is a comparative chart of KB values of standard solvents andsolvent compositions of the present invention.

FIG. 9 is a schematic diagram of boiling point versus percentconcentration of amyl butyrate and HFE 7100.

FIG. 10 is a schematic diagram of boiling point versus percentconcentration of amyl butyrate and Vertrel-XF.

FIG. 11 is a schematic diagram of boiling point versus percentconcentration of amyl butyrate and Vertrel MCA.

FIG. 12 is a schematic diagram of boiling point versus percentconcentration of hexyl propionate and HFE 7100.

FIG. 13 is a schematic diagram of boiling point versus percentconcentration of hexyl propionate and Vertrel-XF.

FIG. 14 is a schematic diagram of boiling point versus percentconcentration of hexyl propionate and Vertrel MCA.

FIG. 15 is a schematic diagram of boiling point versus percentconcentration of n-butyl n-butyrate and HFE 7100.

FIG. 16 is a schematic diagram of boiling point versus percentconcentration of n-butyl n-butyrate and Vertrel-XF.

FIG. 17 is a schematic diagram of boiling point versus percentconcentration of n-butyl n-butyrate and Vertrel MCA.

DETAILED DESCRIPTION OF REPRESENTATIVE EMBODIMENTS

The present invention relates to a solvent composition that preferablydissolves polymers such as Styrene-Ethylene/Butylene-Styrene (SEBS) andcreates a liquid solvent system incorporating the polymer. The resultingsolvent system is preferably suitable for use as a solvent, protectant,coating, sealant, and/or adhesive. Furthermore, the solvent compositionand resulting solvent system of the present invention is preferablyclassed as at least combustible or even more preferably classed asnonflammable and is further preferably relatively safe andenvironmentally friendly. The mixture of components of the solventcomposition and system of the present invention may also be varied toyield a desired evaporation rate and drying time.

Although primarily described herein in terms of its suitability fordissolving polymers, the solvent composition of the present inventionmay have various additional uses. For example, the solvent compositionmay be used as a cleaning agent. Furthermore, it will be clear that thepolymer solvent system of the present invention may have uses inaddition to being used a solvent, protectant, coating, sealant, and/oradhesive. Further, the solvent composition and polymer solvent system ofthe present invention may also be combined with various other componentssuch as suspenders, binders, additives, and/or fillers.

Unless otherwise stated, the following terms used in the specificationand claims have the meanings given below.

As used herein unless otherwise stated, the term “flash point” refers tothe lowest temperature at which a material can vaporize to form anignitable mixture in air.

As used herein unless otherwise state, the term “cloud point” refers tothe composition at which combined components are no longer miscible andthe composition becomes cloudy. The cloud point as used herein isdetermined at ambient temperature.

While various classifications and regulations may vary and differ inassessment and description of flammability and combustibility, below areflammability and combustibility classifications as used herein.

As used herein unless otherwise stated, the term “flammable” refers toliquids with a flash point less than about 100 degree Fahrenheit (38degrees Celsius) when an ignition source is used. The designation of“flammable” herein therefore includes current Environmental ProtectionAgency (EPA) flammability classifications for Class IA liquids (flashpoint below 73 degrees Fahrenheit (23 degrees Celsius) and boiling pointbelow 100 degrees Fahrenheit (38 degrees Celsius)), Class IB liquids(flash point below 73 degrees Fahrenheit (23 degrees Celsius) andboiling point above 100 degrees Fahrenheit (38 degrees Celsius)), andClass IC liquids (flash point above 73 degrees Fahrenheit (23 degreesCelsius) and below 100 degrees Fahrenheit (38 degrees Celsius)).

As used herein unless otherwise stated, the term “combustible” refers toliquids with a flash point less than about 140 degrees Fahrenheit (60degrees Celsius) but greater than about 100 degree Fahrenheit (38degrees Celsius). The designation of “combustible” herein thereforeincludes current EPA flammability classifications for class II liquids(flash point about 100 degrees Fahrenheit (38 degrees Celsius) and below140 degrees Fahrenheit (60 degrees Celsius)).

As used herein unless otherwise stated, the term “nonflammable” refersto liquids with a flash point greater than about 140 degree Fahrenheit(60 degrees Celsius). The designation of “nonflammable” herein thereforeincludes current EPA flammability classifications for class III liquidsincluding both class IIIA liquids (flash point at or above 140 degreesFahrenheit (60 degrees Celsius) and below 200 degrees Fahrenheit (93degrees Celsius)) and class IIIB liquids (flash point at or above 200degrees Fahrenheit (93 degrees Celsius)).

As discussed above, the present invention relates to solventcompositions that dissolve polymers such asStyrene-Ethylene/Butylene-Styrene (SEBS) as well as the resultingpolymer solvent systems that incorporate both the polymer and thesolvent composition. The solvent compositions of the present inventionare preferably minimally combustible and most preferably nonflammable.Further, the solvent compositions are relatively safe to handle andenvironmentally friendly when compared to most currently known solventcompositions such as toluene that are capable of dissolving polymersincluding styrene polymers. Further, the solvent compositions of thepresent invention preferably allows for a range of desirableevaporation/drying rates including evaporation/drying to increase theusability over a wide array of products.

The solvent composition of the present invention is generally composedof at least two primary components: (1) a fluorinated solvent blend and(2) a propionate or a butyrate.

The fluorinated solvent blend includes 1,2-dichloroethylene and afluorinated solvent. 1,2-dichloroethylene, also commonly known as1,2-dichloroethene and 1,2-DCE, has a molecular formula C₂H₂Cl₂ orCClHCClH. Either geometric isomer of 1,2-DCE, including cis-1,2-DCE ortrans-1,2-DCE (t-DCE), may be used. By itself, 1,2-DCE is very flammablewith a flash point of approximately 55.4 degrees Fahrenheit (13 degreesCelsius). It has been determine, however, that 1,2-DCE combined withcertain fluorinated solvents, such as discussed herein, results in anonflammable or, minimally, a combustible composition. Further, it hasbeen determined as discussed herein that t-DCE is very effective atdissolving styrene block polymers. 1,2-DCE, while not considered acarcinogen, is considered a VOC and therefore it is preferred to limitthe quantities of 1,2-DCE used in the fluorinated solvent blend.

Various fluorinated solvents, such as hydrofluorocarbons (HFCs) and/orhydrofluoroethers (HFEs), may be used to compose the solvent compositionof the present invention. For example, a mixture of HFEs, such as ethylnonafluorobutyl ether (C₆H₅F₉O), ethyl nonafluoroisobutyl ether(C₆H₅F₉O), methyl nonafluorobutyl ether (C₅H₃F₉O), and methylnonafluoroisobutyl ether (C₅H₃F₉O), may be used to compose thefluorinated solvent. Novec 72DE is a suitable blend of the abovedisclosed HFEs, which also includes t-DCE. Novec 72DE includesapproximately 68 through 72 weight percent t-DCE, approximately 4through 16 weight percent ethyl nonafluorobutyl ether, approximately 4through 16 weight percent ethyl nonafluoroisobutyl ether, approximately2 through 8 percent methyl nonafluorobutyl ether, and approximately 2through 8 percent methyl nonafluoroisobutyl ether.Methoxy-nonafluorobutane, also known as HFE 7100, may also be used. HFE7100 has a molecular formula of C₄F₉OCH₃ or C₅F₉OH₃. A suitablecombination of HFE with t-DCE is sold under the name Novec 71 D90 andincludes about 90 weight percent t-DCE and 10 weight percent HFE 7100.Another suitable fluorinated solvent is1,1,1,2,2,3,4,5,5,5-decafluoropentane, which has a molecular formula ofC₅F₁₀H₂. 1,1,1,2,2,3,4,5,5,5-decafluoropentane is sold by itself underthe name Vertrel XF and is sold in combination with t-DCE under the nameVertrel MCA. The Vertrel MCA composition includes approximately 61through 63 weight percent 1,1,1,2,2,3,4,5,5,5-ecafluoropentane andapproximately 37 through 39 weight percent t-DCE. Additionally,1,1,1,3,3 pentafluorobutane having a molecular formula of C₄H₅F₅ (CAS406-58-6), 1,1,1,2,3,3,3-heptafluoropropane having a molecular formulaof C₃HF₇ (CAS 431-89-0), and dichlorofluoroethane, also known as1,1-dichloro-1-fluoroethane and having a molecular formula of C₂H₃Cl₂F(CAS 1717-00-6), may be used including combinations thereof.

Additional fluorinated solvent compositions, including fluorinatedsolvent combinations and mixtures, may be used as will be understood bythose of skill in the arts without departing from the scope of thepresent invention.

Various propionates and butyrates may be used in the solvent compositionof the present invention. Example propionates include, but are notlimited to, isoamyl propionate (CAS 105-68-0) and hexyl propionate (CAS2445-76-3). Isoamyl propionate (IAP) has a chemical formula of C₈H₁₆O₂,a flash point of 118 degrees Fahrenheit (48 degrees Celsius), and aboiling point of 321 degrees Fahrenheit (160 degrees Celsius). Hexylpropionate (HP) has a chemical formula of C₉H₁₈O₂, a flash point of 149degrees Fahrenheit (65 degrees Celsius), and a boiling point of 356degrees Fahrenheit (180 degrees Celsius).

Example butyrates include, but are not limited to, isoamyl butyrate (CAS106-27-4), amyl butyrate (CAS 540-18-1), n-butyl n-butyrate (CAS109-21-7), isoamyl isobutyrate (CAS 2050-01-3), and amyl isobutyrate(CAS 2445-72-9). Isoamyl butyrate (IAB) has a chemical formula ofC₉H₁₈O₂, a flash point of 138 degrees Fahrenheit (58 degrees Celsius),and a boiling point of 372 degrees Fahrenheit (189 degrees Celsius).Amyl butyrate (AB) has a chemical formula of C₉H₁₈O₂, a flash point of133 degrees Fahrenheit (56 degrees Celsius), and a boiling point of 370degrees Fahrenheit (188 degrees Celsius). N-butyl n-butyrate (nBnB) hasa chemical formula of C₈H₁₆O₂, a flash point of 127 degrees Fahrenheit(53 degrees Celsius), and a boiling point of 327 degrees Fahrenheit (164degrees Celsius). Isoamyl isobutyrate (IAIB) has a chemical formula ofC₁₈H₃₆O₄, a flash point of 129 degrees Fahrenheit (54 degrees Celsius),and a boiling point of 340 degrees Fahrenheit (171 degrees Celsius).Amyl isobutyrate (AIB) has a chemical formula of C₉H₁₈O₂, a flash pointof 133 degrees Fahrenheit (56 degrees Celsius), and a boiling point of340 degrees Fahrenheit (171 degrees Celsius).

In one embodiment of the present invention that includes propionate, thesolvent composition includes between 26 to 90 weight percent of apropionate and between 10 to 74 weight percent of a fluorinated solventblend. In this embodiment, hexyl propionate may be used. Alternatively,isoamyl propionate may be used. Further, as discussed above, thefluorinated solvent blend preferably includes 1,2-DCE such as t-DCE. Forexample, the solvent composition may include about 68 to about 72 weightpercent t-DCE and about 28 to about 32 weight percent mixture ofhydrofluoroethers, such as ethyl nonafluorobutyl ether, ethylnonafluoroisobutyl ether, methyl nonafluorobutyl ether, and methylnonafluoroisobutyl ether. Alternatively, the solvent composition mayinclude a blend of t-DCE and hydrofluorocarbons as the fluorinatedsolvent blend.

In another embodiment of the present invention that includes propionate,the solvent composition includes between 40 to 65 weight percent of apropionate and between 35 to 60 weight percent of a fluorinated solventblend wherein the fluorinated solvent blend includes t-DCE. In yet afurther embodiment of the present invention, the solvent compositionincludes between 60 to 80 weight percent of a propionate and between 20to 40 weight percent of a fluorinated solvent blend wherein thefluorinated solvent blend includes t-DCE. The solvent composition ispreferably combustible or more preferably nonflammable.

In one embodiment of the present invention that includes butyrate, thesolvent composition includes between 26 to 90 weight percent of abutyrate and between 10 to 74 weight percent of a fluorinated solventblend. In this embodiment n-butyl n-butyrate or amyl butyrate may beused. Alternatively, isoamyl butyrate, isoamyl isobutyrate, and/or amylisobutyrate may be used. Further, as discussed above, the fluorinatedsolvent blend preferably includes 1,2-DCE such as t-DCE. For example,the solvent composition may include about 68 to about 72 weight percentt-DCE and about 28 to about 32 weight percent mixture ofhydrofluoroethers, such as ethyl nonafluorobutyl ether, ethylnonafluoroisobutyl ether, methyl nonafluorobutyl ether, and methylnonafluoroisobutyl ether. Alternatively, the solvent composition mayinclude a blend of t-DCE and hydrofluorocarbons as the fluorinatedsolvent blend.

In another embodiment of the present invention, the solvent compositionincludes between 40 to 65 weight percent of a butyrate and between 35 to60 weight percent of a fluorinated solvent blend wherein the fluorinatedsolvent blend includes t-DCE. In yet a further embodiment of the presentinvention, the solvent composition includes between 60 to 80 weightpercent of a butyrate and between 20 to 40 weight percent of afluorinated solvent blend wherein the fluorinated solvent blend includest-DCE. Like the propionate containing solvent composition, the butyratesolvent composition is also preferably combustible or more preferablynonflammable.

The solvent composition of the present invention may be used for manyapplications and determination of the particular components and rangesof components of the solvent composition typically depends on theparticular use of the composition. For example, one composition may haveproperties better suited for use as a cleaning agent while a differentcomposition may have properties better suited for mixing withconcentrated paints or coatings to act as a carrier for suchconcentrated paints or coatings. Further, certain compositions may beused as a bonding agent while other compositions may be used as adebonder. Moreover, one composition may have properties better suitedfor dissolving a particular polymer, such as those discussed herein andincluding styrene polymers.

Further, selection of a particular propionate or butyrate as well as theamount of fluorinated solvent blend frequently depends on the desiredevaporation/drying rate. For example, if faster drying time is desired,higher quantities of fluorinated solvent blend are typicallyincorporated into the composition and system. In contrast, if slowerdrying time is desired, lower quantities of fluorinated solvent blendare typically incorporated into the composition and system.

As discussed above, the solvent composition of the present invention maybe combined with a polymer or a combination of polymers to create apolymer solvent system of the present invention. For example, thesolvent composition of the present invention may be combined with astyrene polymer to create a styrene polymer solvent system of thepresent invention. A variety of styrene polymers may be used in thepolymer styrene solvent system. For example, in one embodiment, astyrene block copolymer such as Styrene-Ethylene/Butylene-Styrene (SEBS)may be used. Several suitable styrene polymers are sold under the brandname Kraton™ such as Kraton G1652, Kraton G1643 (CAS 66070-58-4), andKraton FG-1901. The styrene polymers are highly versatile and aretypically in the form of synthetic rubber materials including resins,powders, and pellets. Styrene polymer may be combined with a solventcomposition at approximately 1 through 50 weight percent of the solventsystem. In another embodiment, the styrene polymer may be combined witha solvent composition at approximately 10 through 40 weight percent ofthe solvent system. In yet another embodiment, the styrene polymer maybe combined with a solvent composition at approximately 20 through 30weight percent of the solvent system. In a further embodiment, thestyrene polymer may be combined with a solvent composition atapproximately 5 through 25 weight percent of the solvent system.

Moreover, the solvent composition of the present invention may becombined with a methyl methacrylate copolymer to create the polymersolvent system of the present invention. Methyl methacrylate copolymer(CAS 9011-14-7) has a chemical formula of C₅H₈O₂X₂. Paraloid B48N, alsoknown as Acryloid B48N, is an example of a methyl methacrylate copolymerthat is suitable for use in the present invention. Paraloid B48N may bein the form of powder, pellets, or sheets and is typically hard andabrasion resistant. Methyl methacrylate copolymer may be combined with asolvent composition at approximately 1 through 50 weight percent of thesolvent system. In another embodiment, the methyl methacrylate copolymermay be combined with a solvent composition at approximately 10 through40 weight percent of the solvent system. In yet another embodiment, themethyl methacrylate copolymer may be combined with a solvent compositionat approximately 20 through 30 weight percent of the solvent system. Ina further embodiment, the methyl methacrylate copolymer may be combinedwith a solvent composition at approximately 5 through 25 weight percentof the solvent system.

Having generally described this instant disclosure, a furtherunderstanding can be obtained by reference to certain specific examplesillustrated below which are provided for purposes of illustration onlyand are not intended to be all inclusive or limiting unless otherwisespecified.

Testing & Examples

The preparation, identification, and testing of example compositions andsystems of this disclosure are further described below. The particularmaterials and amounts thereof recited in these examples, as well asother conditions and details, should not be construed to unduly limitthis invention. In these examples, all percentages, proportions andratios are by weight unless otherwise indicated.

Several solvent compositions were tested to determine the solvent'sability to dissolve styrene polymers. Further, because a combustible ormore preferably a nonflammable system was sought, the compositions andresulting styrene solvent systems were tested to determine the flashpoint of the compositions and resulting systems. Further, evaporationtimes and drying rates of the compositions and resulting systems areimportant for applicability of the compositions and systems. Thus, theboiling point, which is typically directly related to theevaporation/drying rate, was determined for the compositions andresulting systems.

Table I shown below discloses an example of a propionate and an exampleof a butyrate each having a flash point above 100 degrees Fahrenheit andeach combined with a styrene polymer.

TABLE I Weight % Component Solvency Example 1 75% Isoamyl Propionate(IAP) Dissolved 25% SEBS resin powder (CAS 66070-58-4) Example 2 75%Isoamyl Butyrate (IAB) Dissolved 25% SEBS resin powder (CAS 66070-58-4)

As disclosed above, both the IAP and the IAB dissolved the styrenepolymer at the disclosed amount. The high boiling points of IAP and IABhowever created a system with an evaporation/drying rate significantlyhigher than intended. For example, known flammable styrene polymerdissolvers, such as toluene and PlastiDip liquids, typically haveboiling points around 176 to 248 degrees Fahrenheit (80 to 120 degreesCelsius).

To decrease the evaporation/drying rate caused by the high boilingpoints of the IAP and IAB, fluorinated solvent blends having lowerboiling points were added to the composition. Tables II and III belowdisclose two examples of styrene solvent systems incorporating afluorinated solvent blend.

TABLE II Flash Weight % Component Solvency Point Example 3 41% IsoamylPropionate (IAP) Dissolved No Flash 33% Novec 72DE Observed 68-72 wt. %t-DCE 28-32 wt. % HFE blend (4-16 wt. % ethyl nonafluorobutyl ether,4-16 wt. % ethyl nonafluoroisobutyl ether, 2-8 wt. % methylnonafluorobutyl ether, and 2-8 wt. % methyl nonafluoroisobutyl ether)25% SEBS resin powder (CAS 66070- 58-4)  1% Colorant Liquid Mix ofExample 3 55.4%   Isoamyl Propionate (IAP) 44.6%   Novec 72DE 68-72 wt.% t-DCE 28-32 wt. % HFE blend (4-16 wt. % ethyl nonafluorobutyl ether,4-16 wt. % ethyl nonafluoroisobutyl ether, 2-8 wt. % methylnonafluorobutyl ether, and 2-8 wt. % methyl nonafluoroisobutyl ether)

TABLE III Example 4 33% Isoamyl Butyrate (IAB) Dissolved No Flash 41%Novec 72DE Observed 68-72 wt. % t-DCE 28-32 wt. % HFE blend (4-16 wt. %ethyl nonafluorobutyl ether, 4-16 wt. % ethyl nonafluoroisobutyl ether,2-8 wt. % methyl nonafluorobutyl ether, and 2-8 wt. % methylnonafluoroisobutyl ether) 25% SEBS resin powder (CAS 66070-58-4)  1%Colorant Liquid Mix of Example 4 44.6%   Isoamyl Butyrate (IAB) 55.4%  Novec 72DE 68-72 wt. % t-DCE 28-32 wt. % HFE blend (4-16 wt. % ethylnonafluorobutyl ether, 4-16 wt. % ethyl nonafluoroisobutyl ether, 2-8wt. % methyl nonafluorobutyl ether, and 2-8 wt. % methylnonafluoroisobutyl ether)

As disclosed above, both the IAP/fluorinated solvent composition and theIAB/fluorinated solvent composition dissolved the styrene polymer at thedisclosed amount. Further, the flash points of these styrene solventsystems were tested and no flash was observed. To further lower theevaporation/drying rate of the system, additional amounts of fluorinatedsolvent blend was added to determine the outer limits of solvency. Itwas determined that using the components set forth in Tables II and III,the outer limits of solvency were up to approximately 80-85 weightpercent liquid mix of Novec 72DE and therefore down to approximately15-20 weight percent liquid mix of IAB or IAP (the liquid mix being themixture of fluorinated solvent blend and propionate or butyrate). Abovethis amount of Novec 72DE, the system reached its cloud point and thesystems went from completely miscible to immiscible with two separatephase layers (the top layer being the propionate or butyrate with aspecific gravity around 0.87 and the bottom layer being Novec 72DE witha specific gravity around 1.28). The boiling point of the systemslightly below the upper limit of fluorinated solvent blend was around60-65 degrees Celsius, which is a desirable boiling point foraerosol-can solvent systems.

Tests were also performed to determine if certain fluorinated solventsand fluorinated solvent blends without the use of propionates andbutyrates would effectively dissolve styrene polymers. The t-DCE byitself was very effective at dissolving styrene polymers; however, puret-DCE is highly flammable and has a flash point equal to 36 degreesFahrenheit (2 degrees Celsius). Certain fluorinated solvent blendscontaining t-DCE, however, exhibit nonflammable or combustibleproperties, and it was determined that fluorinated solvents havinghigher amounts of t-DCE were highly effective at dissolving the styrenepolymers. For example, a fluorinated solvent having about 90 weightpercent t-DCE and 10 weight percent methoxy-nonafluorobutane, also knownas HFE 7100, was very effective at dissolving styrene polymers withoutthe addition of propionates or butyrates and is nonflammable. Anacceptable fluorinated solvent having this composition is sold under thename Novec 71D90. Novec 71D90 has a boiling point of approximately 109degrees Fahrenheit (43 degrees Celsius) and a high potential forevaporation of the HFE 7100 component. Thus, to keep the Novec 71 D90from turning flammable, it must be stored in closed containers.

Incorporation of fluorinated solvents without some form of 1,2-DCE intoa styrene solvent system, resulted in the fluorinated solvent saltingout so that the system was not miscible. For example, the system usingNovec 7100 and Vertrel-XF without the addition of 1,2-DCE did not createa miscible solvent system when combined with the SEBS resin. Further,fluorinated solvents with low levels of 1,2,-DCE, such as Vertrel MCA,which has approximately 38 weight percent t-DCE, were also not effectiveat completely dissolving the SEBS resin. On the other hand and asdiscussed above, fluorinated solvents having higher levels of 1,2-DCE,such as Novec 72DE and Novec 71 D90, which typically have greater than65 weight percent t-DCE, resulted in better miscibility and particularlygood miscibility when combined with the propionates/butyrates.

The SEBS resin used in Examples 3 and 4 above, was Kraton G1652 powderalso identified as K084DDi09U. This SEBS resin powder includes a 30/70styrene/rubber ratio. Kraton G1643, which is also identified asK460DDe09U, was substituted into the Examples 3 and 4 above in the placeof Kraton G1652. Kraton G1643 includes a 20/80 styrene/rubber ratio andis less viscous than Kraton G1652 when incorporated into solventsystems; thus, a thinner liquid polymer styrene system resulted. Acombination of Kraton G1652 and Kraton G1643 was also used, whichyielded a desirable viscosity-blend.

Because solvency power is typically measured by the Kauri-Butanol Value(KB value) of a solvent, the KB value was determined for certain solventcompositions of the present invention. The KB value is a measure ofsolvency power whereby the higher the KB value, the higher the solvencypower. KB values were measured using standard techniques such as shownin ASTM D 1133. The dissolving power of each solvent was tested bydissolving Kauri resin and then the dissolvability of the solvents werecompared. A solvent having a KB value between 10-20 is typicallyconsidered a mild solvent while a solvent having a KB value above 75 istypically considered a strong solvent. Further, solvents having a KBvalue over 100 are typically considered powerful solvents. Knownflammable compositions used to dissolve styrene polymer include toluene,which has a KB value of 105.

A solvent composition having 55 weight percent IAP and 45 weight percentNovec 72DE was tested and had a KB value of 78. Further, a solventcomposition having 45 weight percent IAB and 55 weight percent Novec72DE was tested and had a KB value of 66. The KB value of Novec 72DE wasalso determined and was 52. Because KB value of a mixture can sometimesbe approximated by the weighted average of the KB value of thecomponents in the mixture, it was calculated that the KB value of pureIAP is approximately 99 and the KB value of pure IAB is approximately83.

Additional chemical solvents similar to IAP and IAB were tested todetermine solvency power and ability to dissolve styrene polymer.Approximately 25 weight percent Kraton G-1652 SEBS polymer was combinedwith 75 weight percent of the individual chemical solvent. Shear was notused in combining the polymer and the solvent. Hexyl propionate (CAS2445-76-3) was determined to have solvency similar to or better thanIAP. Further, amyl butyrate (CAS 540-18-1), n-butyl n-butyrate (CAS109-21-7), isoamyl isobutyrate (CAS 2050-01-3), and amyl isobutyrate(CAS 2445-72-9) were determined to have solvency similar to or betterthan IAB. Isobutyl isobutyrate (CAS 97-85-8) and n-pentyl propionate(CAS 624-54-4) also dissolved the SEBS polymer and had some flowability.Further, these chemical solvents may be combined with other chemicalsolvents to obtain a preferred evaporation/drying rate as more fullydiscussed below. For example, the above propionates and butyrates may becombined with allyl propionate (CAS 2408-20-0), butyl propionate (CAS590-01-2), methyl amyl ketone (CAS 110-43-0), n-propyl propionate (CAS106-36-5), isobutyl propionate (CAS 540-42-1), tert-butyl propionate(CAS 20487-40-5), ethyl propionate (CAS 105-37-3), methyl propionate(CAS 554-12-1), isopropyl propionate (CAS 637-78-5), ethyl3-ethoxypropionate (CAS 763-69-9), ethyl 2-hydroxypropionate (CAS97-64-3), ethyl 2-hydroxypropanoate (CAS 687-47-8), ethyl butyrate (CAS105-54-4), methyl n-butyrate (CAS 623-42-7), and propyl butyrate (CAS105-66-8).

Because selection of a particular propionate or butyrate as well as theamount of fluorinated solvent blend frequently depends on the desiredevaporation/drying rate, the boiling points of compositions havingvarious concentrations of a fluorinated solvent blend component and apropionate or butyrate component were determined. FIGS. 1 through 7disclose schematic diagrams of boiling points of such solventcompositions of the present invention. A desirable boiling point formany applications of a solvent composition is typically in the range of60 to 130 degrees Celsius or more preferably in the range of 80 to 120degrees Celsius. Except as stated below, the boiling points weremeasured by Galbraith Labs using ASTMD110-11 standards and as set forthherein. The components of the solvent systems were combined at thedesignated weight percent concentration so that the compositions weremiscible in all proportions. The compositions were distilled at ambientpressure (720 to 740 torr) in a concentric tube distillation column andthen allowed to equilibrate at total reflux for at least 60 minutes. Theboiling point of each distillate was measured using a thermocouple.

In FIGS. 1 through 7, Novec 72DE was the fluorinated solvent blend usedand is denoted as Component A. As discussed above, Novec 72DE is a blendof hydrofluoroethers (HFEs) and t-DCE. More particularly, Novec 72DE isapproximately 68 through 72 weight percent t-DCE, approximately 4through 16 weight percent ethyl nonafluorobutyl ether, approximately 4through 16 weight percent ethyl nonafluoroisobutyl ether, approximately2 through 8 percent methyl nonafluorobutyl ether, and approximately 2through 8 percent methyl nonafluoroisobutyl ether. Various propionatesand butyrates are denoted as Component B. At zero percent on thediagram, the composition is entirely Component A, and the boiling pointequals that of Novec 72DE, which has a listed boiling point of 43degrees Celsius. At 100 percent on the diagram, the composition isentirely Component B and would therefore equal the boiling point of theparticular propionate or butyrate. The boiling points of 100 percent ofa component were not tested and instead were taken from readilyavailable Material Safety Data Sheets (MSDS) and related literature onthe particular components.

FIG. 1 is a schematic diagram of boiling point versus percentconcentration of IsoAmyl Propionate (IAP) and Novec 72DE. All testedconcentrations were miscible in all proportions. Table IV shows theexact compositions and measurements used to generate FIG. 1. Asdisclosed in FIG. 1 and Table IV, concentrations of Novec 72DE and IAPin a range of at least 17.5 to 64 weight percent Novec 72DE and 36 to82.5 weight percent IAP have a boiling point range between 74.6 and125.6 degrees Celsius, which, as discussed above, are desirable boilingpoints for many applications of a solvent composition. Further, no flashwas observed in the solvent compositions below a concentration of 75weight percent IAP. Thus, a nonflammable solvent composition was createdover a wide range of IAP concentrations while maintaining desirableevaporation/drying rates.

TABLE IV % Component A % Component B Boiling Point Flash Point (Novec72DE) (IAP) ° C. ° F./° C. 100%   0% 43 No Flash 90% 10% 50.6 No Flash83% 17% 51.6 No Flash 64% 36% 74.6 No Flash 44.6%   55.4%   76.3 NoFlash 45% 55% 81.6 No Flash 35% 65% 88.9 No Flash 35% 65% 91.6 No Flash25% 75% 125.6 No Flash 20% 80% 110.6 64/18 17.5%   82.5%   120.6 82/2810% 90% 131.6 86/30  8% 92% 136.6 93/34  0% 100%  160  103/39.4

FIG. 2 is a schematic diagram of boiling point versus percentconcentration of IsoAmyl Butyrate (IAB) and Novec 72DE. All testedconcentrations were miscible in all proportions. Table V shows the exactcompositions and measurements used to generate FIG. 2. As disclosed inFIG. 2 and Table V, concentrations of Novec 72DE and IAB in a range ofat least 17.5 to 65 weight percent Novec 72DE and 35 to 82.5 weightpercent IAB have a boiling point range between 62.3 and 124.6 degreesCelsius, which, as discussed above, are desirable boiling points formany applications of a solvent composition. Further, no flash wasobserved in the solvent compositions below a concentration of 82.5weight percent IAB. Thus, a nonflammable solvent composition was createdover a wide range of IAB concentrations while maintaining desirableevaporation/drying rates.

TABLE V % Component A % Component B Boiling Point Flash Point (Novec72DE) (IAB) ° C. ° F./° C. 100%   0% 43 No Flash 90% 10% 49.9 No Flash75% 25% 54.9 No Flash 65% 35% 62.3 No Flash 55.4%   44.6%   66.3 NoFlash 55% 45% 66.6 No Flash 37.5%   62.5%   84.6 No Flash 35% 65% 92.6No Flash 25% 75% 101.6 No Flash 20% 80% 124.6 No Flash 17.5%   82.5%  118.6 No Flash 12% 88% 144.6 86/30 10% 90% 162.6 90/32  0% 100%  189 135/57.2

FIG. 3 is a schematic diagram of boiling point versus percentconcentration of Amyl Butyrate (AB) and Novec 72DE. All testedconcentrations were miscible in all proportions. Table VI shows theexact compositions and measurements used to generate FIG. 3. Asdisclosed in FIG. 3 and Table VI, concentrations of Novec 72DE and AB ina range of at least 20 to 60 weight percent Novec 72DE and 40 to 80weight percent AB have a boiling point range between 65.9 and 113.6degrees Celsius, which, as discussed above, are desirable boiling pointsfor many applications of a solvent composition. Further, no flash wasobserved in the solvent compositions below a concentration of 90 weightpercent AB. Thus, a nonflammable solvent composition was created over awide range of AB concentrations while maintaining desirableevaporation/drying rates. Further, because AB was particularly good atdissolving SEBS polymer, the KB value of certain of the belowconcentrations was also determined.

TABLE VI Boiling Flash % Component A % Component B Point Point (Novec72DE) (AB) KB Value ° C. ° F./° C. 100% 0% 52 43 No Flash 90% 10% NotTested 48.6 No Flash 70% 30% Not Tested 57.6 No Flash 60% 40% 69.49 65.9No Flash 50% 50% Not Tested 71.9 No Flash 35% 65% 86.85 86.6 No Flash30% 70% Not Tested 93.6 No Flash 20% 80% 105.67 113.6 No Flash 10% 90%114.98 133.6 102/39  0% 100% 134.19 188  133/56.1

Further, xylene, toluene, and plastidip solvents are flammable chemicalcompositions that may be used in connection with SEBS polymers. Xylenehas a boiling point of approximately 139 degrees Celsius, toluene has aboiling point of approximately 111 degrees Celsius, and PlastiDip mixedsolvent (combination of CAS 64742-48-9, CAS 110-54-3, CAS 108-88-3, andCAS 78-93-3) has a boiling point of approximately 88 degrees Celsius. Asshown in Table VI above, the solvent composition at 90 weight percent ABand 10 weight percent Novec 72DE has a boiling point similar to Xylene,at 80 weight percent AB and 20 weight percent Novec 72DE has a boilingpoint similar to toluene, and at 65 weight percent AB and 35 weightpercent Novec 72DE has a boiling point similar to PlastiDip.Furthermore, standard vapor cleaners used as aerosol-cancarriers/vehicles typically have boiling points of approximately 60-65degrees Celsius. As shown in Table VI above, the solvent composition at40 weight percent AB and 60 weight percent Novec 72DE has a boilingpoint similar to such vapor cleaners.

FIG. 4 is a schematic diagram of boiling point versus percentconcentration of Hexyl Propionate (HP) and Novec 72DE. All testedconcentrations were miscible in all proportions. Table VII shows theexact compositions and measurements used to generate FIG. 4. Asdisclosed in FIG. 4 and Table VII, concentrations of Novec 72DE and HPin a range of at least 20 to 60 weight percent Novec 72DE and 40 to 80weight percent HP have a boiling point range between 64.6 and 110.6degrees Celsius, which, as discussed above, are desirable boiling pointsfor many applications of a solvent composition. Further, no flash wasobserved in the solvent compositions below a concentration of 90 weightpercent HP. Thus, a nonflammable solvent composition was created over awide range of HP concentrations while maintaining desirableevaporation/drying rates. Further, because HP was also particularly goodat dissolving SEBS polymer, the KB value of certain of the belowconcentrations was also determined.

TABLE VII Boiling Flash % Component A % Component B Point Point (Novec72DE) (HP) KB Value ° C. ° F./° C. 100% 0% 52 43 No Flash 90% 10% NotTested 47.9 No Flash 70% 30% Not Tested 54.6 No Flash 60% 40% 68.23 64.6No Flash 50% 50% Not Tested 69.6 No Flash 35% 65% 91.51 98.6 No Flash30% 70% Not Tested 93.9 No Flash 20% 80% 84.52 110.6 No Flash 10% 90%115.92 135.6 106/41 0% 100% 127.11 180 149/65

As shown in Table VII above, the solvent composition at 90 weightpercent HP and 10 weight percent Novec 72DE has a boiling point similarto Xylene, at 80 weight percent HP and 20 weight percent Novec 72DE hasa boiling point similar to toluene, and at 65 weight percent HP and 35weight percent Novec 72DE has a boiling point similar to PlastiDip.Furthermore, the solvent composition at 40 weight percent HP and 60weight percent Novec 72DE has a boiling point similar to standard vaporcleaners used as aerosol-can carriers/vehicles discussed above.

FIG. 5 is a schematic diagram of boiling point versus percentconcentration of n-Butyl n-Butyrate (nBnB) and Novec 72DE. All testedconcentrations were miscible in all proportions. Table VIII shows theexact compositions and measurements used to generate FIG. 5. Asdisclosed in FIG. 5 and Table VIII, concentrations of Novec 72DE andnBnB in a range of at least 20 to 60 weight percent Novec 72DE and 40 to80 weight percent nBnB have a boiling point range between 65.9 and 111.3degrees Celsius, which, as discussed above, are desirable boiling pointsfor many applications of a solvent composition. Further, no flash wasobserved in the solvent compositions below a concentration of 90 weightpercent nBnB. Thus, a nonflammable solvent composition was created overa wide range of nBnB concentrations while maintaining desirableevaporation/drying rates. Further, because nBnB was particularly good atdissolving SEBS polymer, the KB value of certain of the belowconcentrations was also determined.

TABLE VIII % Boiling Component A % Component B Point Flash Point (Novec72DE) (nBnB) KB Value ° C. ° F./° C. 100% 0% 52   43 No Flash 90% 10%Not Tested 48.9 No Flash 70% 30% Not Tested 57.3 No Flash 60% 40%  82.9565.9 No Flash 50% 50% Not Tested 69.3 No Flash 35% 65% 112.54 89.6 NoFlash 30% 70% Not Tested 94.6 No Flash 20% 80% 116.90 111.3 No Flash 10%90% 147.56 130.6  98/36.5 0% 100% 163.04 164 127/52.8

As shown in Table VIII above, the solvent composition at 90 weightpercent nBnB and 10 weight percent Novec 72DE has a boiling pointsimilar to Xylene, at 80 weight percent nBnB and 20 weight percent Novec72DE has a boiling point similar to toluene, and at 65 weight percentnBnB and 35 weight percent Novec 72DE has a boiling point similar toPlastiDip. Furthermore, the solvent composition at 40 weight percentnBnB and 60 weight percent Novec 72DE has a boiling point similar tostandard vapor cleaners used as aerosol-can carriers/vehicles discussedabove.

FIG. 6 is a schematic diagram of boiling point versus percentconcentration of IsoAmyl IsoButyrate (IAIB) and Novec 72DE. All testedconcentrations were miscible in all proportions. Table IX shows theexact compositions and measurements used to generate FIG. 6. Asdisclosed in FIG. 6 and Table IX, concentrations of Novec 72DE and IAIBin a range of at least 25 to 50 weight percent Novec 72DE and 50 to 75weight percent IAIB have a boiling point range between 69.9 and 99.3degrees Celsius, which, as discussed above, are desirable boiling pointsfor many applications of a solvent composition. Further, no flash wasobserved in the solvent compositions having both IAIB and Novec 72DE.Thus, a nonflammable solvent composition was created over a wide rangeof IAIB concentrations while maintaining desirable evaporation/dryingrates.

TABLE IX % Component A % Component B Boiling Point Flash Point (Novec72DE) (IAIB) ° C. ° F./° C. 100% 0% 43 No Flash 75% 25% 54.9 No Flash50% 50% 69.9 No Flash 25% 75% 99.3 No Flash 0% 100% 171 129/53.9

FIG. 7 is a schematic diagram of boiling point versus percentconcentration of Amyl IsoButyrate (AIB) and Novec 72DE. All testedconcentrations were miscible in all proportions. Table X shows the exactcompositions and measurements used to generate FIG. 7. As disclosed inFIG. 7 and Table X, concentrations of Novec 72DE and AIB in a range ofat least 25 to 50 weight percent Novec 72DE and 50 to 75 weight percentAIB have a boiling point range between 71.9 and 96.9 degrees Celsius,which, as discussed above, are desirable boiling points for manyapplications of a solvent composition. Further, no flash was observed inthe solvent compositions having both AIB and Novec 72DE. Thus, anonflammable solvent composition was created over a wide range of AIBconcentrations while maintaining desirable evaporation/drying rates.

TABLE X % Component A % Component B Boiling Point Flash Point (Novec72DE) (AIB) ° C. ° F./° C. 100% 0% 43 No Flash 75% 25% 54.3 No Flash 50%50% 71.9 No Flash 25% 75% 96.9 No Flash 0% 100% 171 133/56.1

While the pure butyrates and propionates disclosed above have highboiling points, which therefore leads to very high evaporation anddrying rates for the solvents, mixing with a fluorinated solvent such asNovec 72DE significantly lowers the boiling points and therefore allowsfor tailoring of a particular desirable evaporation/drying rate as wellas a particular desirable solvency power. Further, a broad range ofnonflammable or combustible compositions are achievable by varying theamount of fluorinated solvent as well as with the particular selectionof propionates and butyrates, including combinations thereof.

Moreover, because the drying/evaporation rate and actual vaporizationrate will also vary depending on the heat of vaporization and cohesiveenergy density, a blend of the above solvents may achieve highlydesirable drying characteristics. For example, a triple-blend of threeof the above solvents, such as a 50/50 weight percent blend of ethylpropionate and Novec 72DE combined with a 50/50 blend of Novec 72DE andAB, HP, and/or nBnB, may result in practically any polymer-contentdissolution and drying rate that is needed for a particular application.

FIG. 8 is a comparative chart of the KB value of standard solvents andthe KB values of the solvent compositions of the present inventiondisclosed in Tables VI-VIII above for AB, HP, and nBnB solvent blendswith Novec 72DE at 40 weight percent, 65 weight percent, 80 weightpercent, 90 weight percent, and 100 weight percent AB, HP, and nBnB. Itis apparent from FIG. 8 that the solvent compositions of the presentinvention are capable of having very high solvency power that can betailored depending on a particular use, while maintaining nonflammableor combustible properties up to a very high concentration of AB, HP, andnBnB.

Because a flash point of 18 degrees Celsius was observed at 80 weightpercent IAP as shown in table IV above and a flash point of 30 degreesCelsius was observed at 88 weight percent IAB as shown in table V above,several additives were combined with the solvent compositions to raisethe observed flash point to at least a preferably combustible level.Test were performed at 9 weight percent Novec 72DE, 81 weight percentIAB/IAP, and 10 weight percent additive. Table XI shown below disclosesthe flashpoints and boiling points of solvent compositions incorporatingadditives including Parachlorobenzotrifluoride (PCBTF), Alpha Terpineol(AT), Benzyl Propionate (BP), and Octyl Propionate (OP).

TABLE XI Boiling Point Flash Point Solvent Composition ° C. ° F./° C. 9% Novec 72DE Not measured 96.8/36   81% IAP 10% PCBTF  9% Novec 72DENot measured 93/34 81% IAP 10% AT  9% Novec 72DE 134 95/35 81% IAP 10%BP  9% Novec 72DE 132 95/35 81% IAP 10% OP  9% Novec 72DE Not measured93/34 81% IAB 10% PCBTF  9% Novec 72DE 162 100.4/38   81% IAB 10% AT  9%Novec 72DE 138 97/36 81% IAB 10% BP  9% Novec 72DE 139 97/36 81% IAB 10%OP

As shown above in Table XI, the addition of several of the disclosedadditives were effective in raising the flash point of the solventcomposition. Further, the addition of 10 weight percent AT to a solventcomposition having 9 weight percent Novec 72DE and 81 weight percent IABresulted in increasing the flash point to a combustible level.

Additional fluorinated solvents other than Novec 72DE were tested withthe above disclosed propionates and butyrates. For example nonflammablesolvent compositions of the present invention were created using HFE7100,1,1,1,2,2,3,4,5,5,5-decafluoropentane, such as sold under the nameVertrel-XF, and a combination of 1,1,1,2,2,3,4,5,5,5-decafluoropentaneand t-DCE sold under the name Vertrel MCA and includes approximately 61through 63 weight percent 1,1,1,2,2,3,4,5,5,5-decafluoropentane andapproximately 37 through 39 weight percent t-DCE. Compositions having 50weight percent IAP, IAB, AB, HP, and nBnB were each combined with 50weight percent of HFE 7100, 50 weight percent Vertrel-XF, and 50 weightpercent Vertrel MCA. The boiling point and flash point of these solventcompositions were then determined and are disclosed in Table XII below.Compositions using Novec 72DE are also set forth in Table XII below aswell as compositions using t-DCE combined with 50 weight percent of eachAB, HP, and nBnB.

TABLE XII 50% 50% Component A Component B Boiling Point ° C. Flash Point° F./° C. HFE 7100 IAP 82 No Flash HFE 7100 IAB 81 No Flash HFE 7100 AB72 No Flash HFE 7100 HP 78 No Flash HFE 7100 nBnB 81 No Flash Vertrel-XFIAP 89 No Flash Vertrel-XF IAB 86 No Flash Vertrel-XF AB 82 No FlashVertrel-XF HP 81 No Flash Vertrel-XF nBnB 84 No Flash Vertrel MCA IAP137 No Flash Vertrel MCA IAB 126 No Flash Vertrel MCA AB 69 No FlashVertrel MCA HP 71 No Flash Vertrel MCA nBnB 73 No Flash Novec 72DE IAP78 No Flash Novec 72DE IAB 73 No Flash Novec 72DE AB 72 No Flash Novec72DE HP 70 No Flash Novec 72DE nBnB 69 No Flash Novec 72DE IAIB 70 NoFlash Novec 72DE AIB 72 No Flash t-DCE AB 77 41/5 t-DCE HP 85 36/2 t-DCEnBnB 75 41/5

100 percent HFE 7100 has a boiling point of 61 degrees Celsius, 100percent Vertrel-XF has a boiling point of 55 degrees Celsius, 100percent Vertrel MCA has a boiling point of 39 degrees Celsius, 100percent Novec 72DE has a boiling point of 43 degrees Celsius, and 100percent t-DCE has a boiling point of 48 degrees Celsius. None of thesepure solvents has a flash point except t-DCE has a flash point of 36degrees Fahrenheit (2 degrees Celsius). Because the propionates andbutyrates combined with t-DCE resulted in a flammable solventcomposition, it is clear that the primary contributor of nonflammabilityis the result of the HFE/HFC fluorinated solvent.

As discussed above, however, several of the low or non-t-DCE containingfluorinated solvents typically do not effectively dissolve SEBS polymerat the above 50/50 concentration levels. The cloud points of severalstyrene solvent systems using HFE 7100, Vertrel-XF, and Vertrel MCA areset forth below in Table XIII. As discussed above, the cloud point isthe composition where the addition of the fluorinated solvent to thepolymer system leads to saturation so that a cloudy liquid results andsalting out occurs.

TABLE XIII Propionate/Butyrate Fluorinated Solvent Percent FS additionto Composition (FS) reach Cloud Point 75% AB + 25% SEBS HFE 7100 10-15%75% AB + 25% SEBS Vertrel-XF 15-20% 75% AB + 25% SEBS Vertrel MCA 15-20%75% HP + 25% SEBS HFE 7100 10-15% 75% HP + 25% SEBS Vertrel-XF 10-15%75% HP + 25% SEBS Vertrel MCA 20-25% 75% nBnB + 25% SEBS HFE 7100 15-20%75% nBnB + 25% SEBS Vertrel-XF 10-15% 75% nBnB + 25% SEBS Vertrel MCA10-15%

Boiling points and flash points of the solvent compositions using AB,HP, and nBnB as the propionate or butyrate and HFE 7100, Vertrel-XF,Vertrel MCA as the fluorinated solvent are shown in FIGS. 9-17 andcorresponding tables XIV-XXIII below.

TABLE XIV % Component A % Component B Boiling Point Flash Point (HFE7100) (AB) ° C. ° F./° C. 100% 0% 61 No Flash 50% 50% 71.9 No Flash 12%88% 183 149/65 0% 100% 188 133/56.1

TABLE XV % Component A % Component B Boiling Point Flash Point(Vertrel-XF) (AB) ° C. ° F./° C. 100% 0% 55 No Flash 50% 50% 82 No Flash17% 83% 184 149/65 0% 100% 188 133/56.1

TABLE XVII % Component A % Component B Boiling Point Flash Point(Vertrel MCA) (AB) ° C. ° F./° C. 100% 0% 39 No Flash 50% 50% 69 NoFlash 17% 83% 185 160/71 0% 100% 188 133/56.1

TABLE XVIII  % Component A % Component B  Boiling Point Flash Point (HFE 7100) (HP) ° C. ° F./° C. 100% 0% 61 No Flash 50% 50% 78 No Flash12% 88% 187 160/71 0% 100% 180 149/65

TABLE XIX % Component A % Component B Boiling Point Flash Point(Vertrel-XF) (HP) ° C. ° F./° C. 100% 0% 55 No Flash 50% 50% 81 No Flash12% 88% 188 163/73 0% 100% 180 149/65

TABLE XX % Component A % Component B Boiling Point Flash Point (VertrelMCA) (HP) ° C. ° F./° C. 100% 0% 39 No Flash 50% 50% 71 No Flash 21% 79%130.9 No Flash 0% 100% 180 149/65

TABLE XXI % Component A % Component B Boiling Point Flash Point (HFE7100) (nBnB) ° C. ° F./° C. 100% 0% 61 No Flash 50% 50% 81 No Flash 17%83% 163 133/56 0% 100% 164 127/52.8

TABLE XXII % Component A % Component B Boiling Point Flash Point(Vertrel-XF) (nBnB) ° C. ° F./° C. 100% 0% 55 No Flash 50% 50% 84 NoFlash 12% 88% 163 131/55 0% 100% 164 127/52.8

TABLE XXIII % Component A % Component B Boiling Point Flash Point(Vertrel MCA) (nBnB) ° C. ° F./° C. 100% 0% 39 No Flash 50% 50% 73 NoFlash 12% 88% 146 No Flash 0% 100% 164 127/52.8

Since the low t-DCE or t-DCE free HFE/HFC solvents, such as HFE 7100,Vertrel-XF, and Vertrel MCA, combined with the propionates or butyratesand an SEBS resin typically salt-out and reach a cloud point at arelatively low weight percent (approximately 10-30 weight percent),their use in dissolving styrene polymers and creating useful systemsthereof is limited. These solvent compositions without the styrenepolymer, however, are nonflammable and may be useful in otherapplications requiring an enhanced or tailored solvency power solvent.

Tests were also performed using the AB and Novec 72DE solventcomposition and multiple types of styrene polymers both with and withouta tackifying resin, such as Eastotac H-100W Resin, which is ahydrogenated hydrocarbon resin. The solvent composition were mixed with65 weight percent AB and 35 weight percent Novec 72DE and combined with14 weight percent of three SEBS polymers including Kraton G-1652, KratonG-1643, and Kraton FG-1901 to dissolve the SEBS polymers. All three SEBSpolymers completely dissolved without shear in the AB and Novec 72DEsolvent composition to create styrene polymer systems of the presentinvention. The solvent system having Kraton FG-1901 had high adhesion tometal thereby reducing the need for a tackifying resin. Incorporatingthe tackifying resin at approximately ⅓ of the SEBS polymer level led toflowable and adherent coatings for each of the above styrene solventsystems.

The solvent compositions of the present invention were also combinedwith methyl methacrylate copolymer. For example, 52 weight percent ABwas combined with 28 weight percent Novec 72DE and 20 weight percentParaloid B48N polymer pellets. A nonflammable miscible polymer solventsystem was formed. A system including 55 weight percent AB, 30 weightpercent Novec 72DE, and 15 weight percent Kraton FG-1901 SEBS resinpowder was also prepared for comparative purposes. The Kraton FG-1901was used because of its ability to adhere to metals without the use oftackifying resins. Both solvent systems were nonflammable and formedclear liquids. Further, both systems were coated onto aluminum couponsto create a thin polymer film on the coupon. The polymer films driedonto the aluminum coupons in approximately three hours atambient/room-temperature (approximately 21 degrees Celsius). This timemay be accelerated by placing the coupons in a dryer at 60 degreesCelsius for approximately one hour or by using a traditional hair dryerset on high heat and low fan speed for approximately 3 through 5minutes. A solvent composition having approximately 65 weight percent ABand 35 weight percent Novec 72DE was then applied to the film afterdrying. Both films were removed from the aluminum coupon inapproximately one minute.

While the polymer films were transparent, traditional pigments andcolorants may be added to the systems to provide coloring for the films.In one embodiment, titanium oxide was added to create a white film,which assisted with visual clarity of complete film application to thesubstrate as well as removal from the substrate.

The methyl methacrylate copolymer solvent system and the comparativestyrene polymer solvent system discussed above were also blended. Theblend of these systems was miscible. The styrene polymer solvent systemalone is more flexible than the methyl methacrylate copolymer solventsystem. Further, the methyl methacrylate copolymer solvent system aloneis harder and more abrasion resistant than the styrene polymer solventsystem. Because the blend of these solvent systems results in a misciblesystem, the properties of the blended system can be tailored as neededfor a particular application.

INDUSTRIAL APPLICABILITY

As discussed above, the solvent compositions and polymer solvent systemsof the present invention may be used for many applications anddetermination of the particular components and ranges of components ofthe compositions and systems typically depend on the particular use ofthe compositions and/or systems. Frequently, additional materials andadditives may be incorporated into the compositions and systems, such asthe tackifying resins discussed above.

In addition to the use of tackifying resins, colorants, additives, andfillers may be added to the solvent compositions and polymer solventsystems of the present invention. For example, approximately 1-10 weightpercent of a colorant or pigment, such as those sold by Sun ChemicalCorporation, may be incorporated into the solvent composition or polymersolvent system. In one embodiment, approximately 4-8 weight percent ofthe composition or system is a colorant. In another embodimentapproximately 6 weight percent of the composition or system is acolorant. Several colorants, including organic, inorganic, and blendedorganic-inorganic colorants, may be used with the compositions andsystems of the present invention.

Further the solvent compositions and systems of the present inventionmay contain additives, agents, binders, suspenders, and/or viscositymodifiers such as cellulosics, including hydroxypropylcellulose or ethylcellulose, and polyvinylpyrrolidone. Typical viscosity modifierspreferably include those that are compatible with non-aqueousfluids/liquids as well as propionates and/or butyrates, such asorgano-clays. Ethyl cellulose at low percentages, such as 1-4 weightpercent of the composition or system, typically improves bonding of thestyrene solvent system to metals. Further, the SEBS polymer may act as abinder/suspender in reduced quantities by helping to bond down fillers(i.e., pigments or inorganic additives) to modify the color and/orperformance of these materials.

As discussed above, the solvent compositions of the present inventionmay be utilized as cleaners including removal of polymer resins andfilms since the solvents may be capable of dissolving such resins andfilms. Further, the polymer solvent systems may be utilized as a glueand/or as a bonding agent. Because the solvent composition and systemsof the present invention are typically non-aqueous, water reactivecompounds may be incorporated for use as paintable coatings. Further,such solvents, systems, and coatings may be encapsulated in order toreduce reactivity with water and extend their usefulness in anair-with-moisture environment.

Functional additives for the polymers and styrene polymers such asantioxidants, light (UV) stabilizers, surfactants, plasticizers,tackifiers, dispersants, biocides, binders/suspenders, extenders, flameretardants, blocking agents, and lubricants as well as other rubber andplastic compounding ingredients and other “fillers”, may be incorporatedinto the systems of the present invention. For example, additives suchas those disclosed in U.S. Pat. Nos. 3,239,478; 4,536,454; 4,745,139;5,315,940; and 5,777,043; as well as U.S. Patent Publication No.2005/0119403 A1 may be useful additives to the compositions and systemsof the present invention and are hereby incorporated by reference. Theseadditives preferably do not change the properties including flammabilityof the solvent compositions and polymer systems of the presentinvention.

The solvent composition and polymer solvent system of the presentinvention may be combined with a nonflammable propellant, such as HFC134A propellant or HFO-1234ze, when canned for use as an aerosol spray.The styrene solvent system of the present invention combined with anonflammable propellant is capable of spraying on most substrates andcompares to PlastiDip spray except that the spray of the presentinvention may be nonflammable or minimally combustible. In contrast,PlastiDip spray is very flammable.

Further, the polymer solvent system may incorporate boron nitride toenhance thermal conductivity and result in a nonflammable brushable ordippable paint or coatings. Boron nitride may also be incorporated intoa polymer solvent system utilizing propellant for use as an aerosol canspray. The polymer solvent system such as the styrene solvent system maybe used for sealing such as vacuum sealing or leak-sealing, or forcreating an electrically insulating and flexible polymer layer, film, orcoating. Such a flexible layer or film may also be used for makinggaskets, for sealing mating surfaces, for water protection to preventwater from reacting with highly water reactive material, and forpreventing oxidation, rusting, and/or tarnishing due to gases, vapors,and liquids. Further, the polymer solvent system utilizing polymers suchas a styrene block copolymer or a methyl methacrylate copolymer may beused for sealing in fibers on the surface of porous ceramics such aslightweight fiber ceramic insulation. Advantageously, the polymersolvent system may allow for safer handling and then burn off duringinitial heating in the furnace environment.

The solvent compositions and polymer solvent systems of the presentinvention may be used as protectants such as for mirrors and highlypolished surfaces. For example, a styrene polymer solvent system of thepresent invention may incorporate tackifiers to create a peelablecoating, which protects a surface but is easily removed. Alternatively,as discussed above, the polymer solvent system may be used as aprotectant on a substrate or surface without the addition of tackifiers.After application, the system will dry on a surface or substrate therebycreating a polymer film or layer that may provide chemical resistivity,corrosion protection, electrical insulation, and/or scratch/abrasionresistance. A solvent composition of the present invention can later beapplied to the polymer film or layer when it is necessary to remove thefilm or layer. Additionally, the solvent compositions of the presentinvention may also be used to dissolve layers, films, and coatings otherthan polymer layers, films, and coatings without departing from thespirit and the scope of the invention.

While various embodiments and examples of this invention have beendescribed above, these descriptions are given for purposes ofillustration and explanation, and not limitation. Variations, changes,modifications, and departures from the compositions, systems, andmethods disclosed above may be adopted without departure from the spiritand scope of this invention. In fact, after reading the abovedescription, it will be apparent to one skilled in the relevant art(s)how to implement the invention in alternative embodiments. Thus, thepresent invention should not be limited by any of the above describedexemplary embodiments.

Further, the purpose of the Abstract is to enable the examining officeand the public generally, and especially the scientists, engineers, andpractitioners in the art who are not familiar with patent or legal termsor phraseology, to determine quickly from a cursory inspection thenature and essence of the technical disclosure of the application. TheAbstract is not intended to be limiting as to the scope of the inventionin any way.

What is claimed is:
 1. A solvent composition comprising between 60 to 90weight percent of a butyrate, and between 10 to 40 weight percent of afluorinated solvent blend, wherein the fluorinated solvent blendincludes t-DCE.
 2. The solvent composition of claim 1 wherein saidbutyrate is selected from the group consisting of n-butyl n-butyrate,amyl butyrate, isoamyl isobutyrate, amyl isobutyrate, and isoamylbutyrate.
 3. The solvent composition of claim 1, wherein saidcomposition is nonflammable.
 4. The solvent composition of claim 1wherein said fluorinated solvent blend comprises hydrofluoroether. 5.The solvent composition of claim 4 wherein said fluorinated solventblend includes 68 to 72 weight percent t-DCE and 28 to 32 weight percentmixture of hydrofluoroethers.
 6. The solvent composition of claim 1wherein said fluorinated solvent blend comprises hydrofluorocarbon. 7.The solvent composition of claim 1 comprising: between 60 to 80 weightpercent of the butyrate, and between 20 to 40 weight percent of thefluorinated solvent blend.
 8. The solvent composition of claim 1 whereinsaid composition comprises 65 weight percent of the butyrate, whereinsaid butyrate is amyl butyrate, and 35 weight percent of the fluorinatedsolvent blend, wherein said fluorinated solvent blend includes between68 to 72 weight percent t-DCE and 28 to 32 weight percent mixture ofhydrofluoroethers.
 9. The solvent composition of claim 8 wherein saidcomposition is used to dissolve a polymer.
 10. The solvent compositionof claim 9 wherein said polymer is selected from the group consisting ofan SEBS polymer and a methyl methacrylate copolymer.
 11. The solventcomposition of claim 1 wherein said composition comprises 80 weightpercent of the butyrate, wherein said butyrate is amyl butyrate, and 20weight percent of the fluorinated solvent blend, wherein saidfluorinated solvent blend includes between 68 to 72 weight percent t-DCEand 28 to 32 weight percent mixture of hydrofluoroethers.
 12. Thesolvent composition of claim 1 wherein said composition comprises 90weight percent of the butyrate, wherein said butyrate is amyl butyrate,and 10 weight percent of the fluorinated solvent blend, wherein saidfluorinated solvent blend includes between 68 to 72weight percent t-DCEand 28 to 32 weight percent mixture of hydrofluoroethers.
 13. Thesolvent composition of claim 1 wherein said composition furthercomprises additives selected from the group consisting of a tackifier,an antioxidant, and a UV-stabilizer.
 14. The solvent composition ofclaim 1 further comprising an additive, said additive includes alphaterpineol.
 15. The solvent composition of claim 1 wherein saidcomposition further comprises a nonflammable propellant and saidcomposition is incorporated into an aerosol can.
 16. A polymer solventsystem comprising a polymer and the solvent composition according toclaim
 1. 17. The polymer solvent system of claim 16, wherein said systemis nonflammable.
 18. The polymer solvent system of claim 16 wherein saidbutyrate is selected from the group consisting of n-butyl n-butyrate,amyl butyrate, isoamyl isobutyrate, amyl isobutyrate, and isoamylbutyrate.
 19. The polymer solvent system of claim 16 wherein saidfluorinated solvent blend comprises hydrofluoroether.
 20. The polymersolvent system of claim 19 wherein said fluorinated solvent blendincludes 68 to 72 weight percent t-DCE and 28 to 32 weight percentmixture of hydrofluoroethers.
 21. The polymer solvent system of claim 16wherein said fluorinated solvent blend comprises hydrofluorocarbon. 22.The polymer solvent system of claim 16 comprising: between 60 to 80weight percent of the butyrate, and between 20 to 40 weight percent ofthe fluorinated solvent blend.
 23. The polymer solvent system of claim16 wherein said system is used as a liquid rubber agent.
 24. The polymersolvent system of claim 16 wherein said system is used as a paintcarrier.
 25. The polymer solvent system of claim 16 wherein said systemis used as a cleaning agent.
 26. The polymer solvent system of claim 16wherein said system is used as a debonder.
 27. The polymer solventsystem of claim 16 wherein said system is used as a bonding-agent. 28.The polymer solvent system of claim 16 wherein said system is applied toa surface to form a polymer film on said surface, said polymer film isremovable from said surface by applying said solvent composition to saidpolymer film.
 29. The polymer solvent system of claim 16 wherein saidbutyrate is a blend of butyrates.
 30. The polymer solvent system ofclaim 16 wherein said system further comprises additives selected fromthe group consisting of a tackifier, an antioxidant, and aUV-stabilizer.
 31. The polymer solvent system of claim 16 furthercomprising an additive, said additive includes alpha terpineol.
 32. Thepolymer solvent system of claim 16 wherein said system further comprisesa nonflammable propellant and said system is incorporated into anaerosol can.
 33. A solvent composition comprising: between 26 to 90weight percent of a butyrate, and between 10 to 74 weight percent of afluorinated solvent blend, wherein the fluorinated solvent blendincludes t-DCE and HFE 7100 wherein said fluorinated solvent blendcomprises hydrofluoroether and said hydrofluoroether is HFE
 7100. 34.The solvent composition of claim 33 wherein said fluorinated solventblend comprises 90 weight percent t-DCE and 10 weight percent HFE 7100.35. A polymer solvent system comprising a polymer and the solventcomposition according to claim
 33. 36. The polymer solvent system ofclaim 35 wherein said fluorinated solvent blend comprises 90 weightpercent t-DCE and 10 weight percent HFE
 7100. 37. A solvent compositioncomprising: between 26 to 90 weight percent of a butyrate, and between10 to 74 weight percent of a fluorinated solvent blend, wherein thefluorinated solvent blend includes t-DCE and a mixture ofhydrofluoroethers of ethyl nonafluorobutyl ether, ethylnonafluoroisobutyl ether, methyl nonafluorobutyl ether, and methylnonafluoroisobutyl ether.
 38. The solvent composition of claim 37wherein said mixture of hydrofluoroethers includes approximately 4through 16 weight percent of said ethyl nonafluorobutyl ether,approximately 4 through 16 weight percent of said ethylnonafluoroisobutyl ether, approximately 2 through 8 weight percent ofsaid methyl nonafluorobutyl ether, and approximately 2 through 8 weightpercent of said methyl nonafluoroisobutyl ether.
 39. A polymer solventsystem comprising a polymer and the solvent composition according toclaim
 37. 40. The polymer solvent system of claim 39 wherein saidmixture of hydrofluoroethers includes approximately 4 through 16 weightpercent of said ethyl nonafluorobutyl ether, approximately 4 through 16weight percent of said ethyl nonafluoroisobutyl ether, approximately 2through 8 weight percent of said methyl nonafluorobutyl ether, andapproximately 2 through 8 weight percent of said methylnonafluoroisobutyl ether.
 41. A solvent composition comprising: 40weight percent of a butyrate, wherein said butyrate is amyl butyrate,and 60 weight percent of a fluorinated solvent blend, wherein saidfluorinated solvent blend includes between 68 to 72 weight percent t-DCEand 28 to 32 weight percent mixture of hydrofluoroethers.
 42. Thesolvent composition of claim 41 wherein said composition is used as acleaning agent.
 43. A solvent composition comprising: between 26 to 90weight percent of a blend of ethyl propionate and amyl butyrate, andbetween 10 to 74 weight percent of a fluorinated solvent blend, whereinthe fluorinated solvent blend includes t-DCE.
 44. A polymer solventsystem comprising a polymer and the solvent composition according toclaim
 43. 45. A polymer solvent system comprising: a solvent compositioncomprising between 26 to 90 weight percent of a butyrate, and between 10to 74 weight percent of a fluorinated solvent blend, wherein thefluorinated solvent blend includes t-DCE, and a polymer, wherein thepolymer solvent system includes between 50 to 99 weight percent of thesolvent composition and 1 to 50 weight percent of the polymer.
 46. Thepolymer solvent system of claim 45 comprising between 75 to 95 weightpercent of the solvent composition and 5 to 25 weight percent of thepolymer.
 47. The polymer solvent system of claim 46 wherein said polymeris styrene block copolymer.
 48. The polymer solvent system of claim 47wherein said styrene block copolymer is SEBS resin.
 49. The polymersolvent system of claim 46 wherein said polymer is methyl methacrylatecopolymer.
 50. A polymer solvent system comprising: a solventcomposition comprising between 26 to 90 weight percent of a butyrate,and between 10 to 74 weight percent of a fluorinated solvent blend,wherein the fluorinated solvent blend includes t-DCE, and a polymer,wherein said polymer includes styrene block copolymer.
 51. A polymersolvent system comprising: a solvent composition comprising between 26to 90 weight percent of a butyrate, and between 10 to 74 weight percentof a fluorinated solvent blend, wherein the fluorinated solvent blendincludes t-DCE, and a polymer, wherein said polymer includes methylmethacrylate copolymer.
 52. The polymer solvent system of claim 51wherein said polymer further includes styrene block copolymer.